HBR50 Hot Bar Reflow Solder, Bonding, and Staking
The HBR50 uses our proven multi-axis platform, but incorporates a PID temperature controller to quickly heat a thermode for solder, heat stake or resistance braze applications.
- Table top hot bar solder, heat seal bonding, and plastic heat stake machine
- Configure any combination of X, Y, Z, and theta axes for your hot bar or hot boss joining needs
- Precise alignment fixtures for bonding flex circuits, wires, ribbon cables, etc. to PCB's
- Integrated pulsed temperature controller and WeldWorks Software Suite manages unlimited heat profiles
- Ideal machine for quickly heat staking small metal parts to plastic.
Special Options
- Polyimide (Kapton) interposer using our exclusive freewheel advancer mechanism- prevents thermode contamination
- Anisotropic conductive film (ACF) cutting and feeding system
View Hot Bar Bonding and Staking Brochures
HBR50 Product Overview
HBR50 Complete Product Brochure (6 pages)